SM320-21001Y
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EST 1U, customized design for 1U server
Adopting high thermal conductivity materials: copper + aluminum base that combines with high-density fin combine and unique heat pipes.
It supports up to 205 Watts CPU power heat dissipation and is suitable for blade and 1U servers.
| SUNON P/N | SM320-21001Y |
| CPU Support | Intel® Sapphire Rapids Processor |
| CPU Socket | LGA 4677 |
| Solution | 1U Server and up |
| Dimensions (mm) | 118*78*24.7mm |
| *TDP (W) | 205W |
| Weight (g) | 265g |
| Material | Aluminum, Copper, ADC10 |
| Surface Treatment | Nickle plating |
| TIM | SHIN-ETSU X23-7921 |
| * TDP=Thermal Power |